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PCB Through Hole Size for Lead Free

Electronics Forum | Thu Nov 08 19:56:08 EST 2007 | davef

Josh: Your 0.009" [0.228 mm] clearance should be fine. The minimum clearance should be ~0.008" [0.20 mm]. Is the 0.039" [0.99 mm] the measured or the expected hole diameter? While we wouldn't like it, we wouldn't be surprised to see 0.008" [0.20 mm

component attrition

Electronics Forum | Tue Feb 06 10:55:58 EST 2001 | pjc

Larry, Our specification is 0.075% for our Fuji CP3 and IP2 machines. At or above that figure the Maintenance Dept. has to get to work. We typically see 0.03% to 0.05% on average. The Fuji machines are all vision centering. We have found feeders are

Zero flux or paste spattering?

Electronics Forum | Wed Jan 14 06:42:38 EST 2004 | tommy

We see spattered(spitting of flux or solder to nearby area) solder/flux on gold fingers.We view the gold fingers area under 30x before reflow and it is cleaned but after reflow we see flux droplets or solder on gold fingers. We tried to changed a new

Wave soldering SMT component spacing

Electronics Forum | Thu Aug 29 20:01:23 EDT 2002 | davef

Many people use the same spacing [and pad designs] as they use for primary side SMT. We don�t. DOWN STREAM SMT-TO-SMT SPACING: In addition to proper orientation, components cannot be immediately upstream of terminations that are to be soldered or b

Zero flux or paste spattering?

Electronics Forum | Sat Jan 10 10:28:06 EST 2004 | tommy

Is it possible to have zero flux or paste spattering for all smt reflow pcbs. We are seeing around 0.4% of flux spattering and looking forward to zero defect.

Cpk For 0201 Placement

Electronics Forum | Mon Jan 31 07:01:56 EST 2005 | pjc

These guys http://www.cetaq-americas.com/index.shtml have the CmController that can do the measurement to back up the p&p vendor's claim. A CpK of 1.33 ain't bad. Would like to see 2.0. The picking is critical too. Ask vendors for pick accuracy and

Au Thickness in ENIG PCB

Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare

0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare

Wire to board soldering

Electronics Forum | Mon Jun 19 22:47:36 EDT 2006 | davef

So, a 10SWG is about an 8AWG. We can't think of a IPC standard for design of this type of product. That the solder is running up the wire indicates something is wrong. We wonder if either: * Holes in the board might be too large for the wire. Doe

What Will I See

Electronics Forum | Mon Jun 18 10:21:54 EDT 2001 | bphilips

We are considering adding x-ray inspection equipment. What can I expect to see with X-ray?

It is okay to use a toaster to bake components?

Electronics Forum | Tue Aug 26 10:55:27 EDT 2008 | wavemasterlarry

I gotcha. Leave it to the profesionals. (see my picture to see why)

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